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              | 1. layer:1-22 
 2. Board finished thickness:0.2mm-7.0mm
 
 3 . Meterial:FR4,CEM-3,High TG,FR4 Halogen Free,Rogers
 
 4. Max. Finished board size:580*900m
 
 5. Min hole size:4mil(0.1mm)
 
 6. Min trace width/space:3.5mil
 
 7. Surface finishing/treatment:HASL/Lead free HASL,Imemersion sliver,immersion Tin,OSP
 
 8. Copper thickness:0.5oz to 6oz
 
 9. solder mask color:green/yellow/black/red/blue
 
 10. Copper thickness in hole:>18um
 
 11.Outline tolerance :+/-0.13mm
 
 Hole size tolerance:PTH+/-0.076mm NPTH+/-0.05mm
 
 12.Quality ensure:UL approval TS16949:2002
 
 13.Buried and Blind vias,impedance control ,via plug,BGA soldering,Gold finger
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                      | Company : | Vinas Electronic CO.,LTD |  
                      | Email: | Contact us |  
                      | URL: | ******** |  
                      | Phone: | ********* |  
                      | Fax : | ********* |  
                      | Country : | China |  
                      | Address : | ********* |  
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